California-Pacific-Northwest AI Hardware Hub
(NORTHWEST-AI HUB)
(NORTHWEST-AI HUB)
The Microelectronics Commons California-Pacific-Northwest AI Hardware Hub (“Northwest-AI-Hub” or “NW-AI-Hub”) is a network of physical facilities and providers of digital assets with the mission to serve regional and national needs for lab-to-fab transition of AI hardware technologies.

Contact The Northwest AI Hub
Technology Areas Supported by the Hub
Hub Project Awards
- Artificial Intelligence (AI) Hardware ($6.7M)
- Energy-Efficient and Scalable AI Hardware Systems through Heterogeneous Integration of Specialized Chiplets
- This project will use innovations in semiconductor materials, integration technologies and AI system architecture to drastically improve energy consumption and performance of AI hardware. Interconnected heterogeneous chiplets, built using leading-edge CMOS and 3D CMOS+X semiconductor technologies such as carbon nanotube transistors, resistive memory, and oxide semiconductors, form the foundation for such AI systems.
- Energy-Efficient and Scalable AI Hardware Systems through Heterogeneous Integration of Specialized Chiplets
- Artificial Intelligence (AI) Hardware ($5.7M)
- Energy-Efficient, Scalable, and Self-Learning AI Hardware with 3D Electronic-Photonic-Integrated-Circuits
- This project pursues transformative improvements in AI Hardware’s speed, energy-efficiency, scalability, and self-learning capabilities for next-generation U.S. defense needs. The project approach combines “best-of-both-worlds” innovations in photonics and electronics including CMOS+X devices and integrates them into compact 3D photonic-electronic-integrated circuit modules.
- Energy-Efficient, Scalable, and Self-Learning AI Hardware with 3D Electronic-Photonic-Integrated-Circuits
- Artificial Intelligence (AI) Hardware ($4M)
- CMOS+X: Integrated Ferroelectric Technologies for Ultra Efficient AI Hardware
- This project aims to substantially improve energy efficiency for future AI hardware by exploiting unique properties of ferroelectric materials. This project will focus on lowering the power supply voltage of computing hardware as well as achieving non-volatile memory that can be directly integrated with the microprocessor.
- CMOS+X: Integrated Ferroelectric Technologies for Ultra Efficient AI Hardware
Hub Name Member List
Agni Semi LLC
AIM Photonics
Ansys, Inc.
Applied Materials
Atomic Semi Inc.
Averatek Corporation
Ayar Labs Inc.
BAE Systems, Inc.
Cadence
California Manufacturing Technology Consulting (CMTC)
California State University Sacramento
Carnegie Mellon University
Center for PRocessing with Intelligent Storage and Memory (PRISM)
Chip Scan, Inc.
Duke University
Foothill College
George Washington University
Georgia Institute of Technology
GlobalFoundries
Grinding & Dicing Services Inc.
Hewlett Packard Enterprise (HPE)
Honeywell International Inc.
IBM
imec IC-link USA
Intel
LAM Research
Lawrence Berkeley National Laboratory (LBNL)
Lawrence Livermore National Laboratory (LLNL)
Lockheed Martin
Metal Oxide Semiconductor Implementation Service (MOSIS)
Microsanj LLC
Microsoft
MindHome, Inc.
Mission College
MIT Lincoln Laboratory
Nalu Scientific
NextFlex
Nhanced Semiconductors, Inc.
Northrop Grumman Corporation
Northwestern University
Numem Inc.
NVIDIA Corporation
Oregon State University
Plug and Play LLC
Portland State University
Raith America, Inc.
Research Foundation for State University of New York (RF SUNY)
RTX Corporation
San Jose State University
Sandia National Laboratories
Siemens
Silicon Catalyst
SiliconCore Technology Inc.
Silitronics
Skywater Technology
SLAC National Accelerator Laboratory
SRI International-Palo Alto Research Center (PARC)
Stratio Inc.
STRATIO, INC.
SUNY Polytechnic Institute
Synopsys, Inc.
Texas A&M University
University of Albany, State University of New York
University of California, Berkeley (UCB)
University of California, Davis (UCD)
University of California, Los Angeles (UCLA)
University of California, San Diego (UCSD)
University of Florida
University of Hawaii, Mānoa
University of Southern California (USC)
University of Washington
Western Digital Corporation